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AI 算力 · A 股AI COMPUTE · A-shares

AI COMPUTEAI 算力

AI 数据中心 / 加速芯片。A 股卡位:电力、光互连、HBM、液冷、网络。AI data center / accelerator chips. A-share chokepoints: Power, Optical interconnect, HBM, Liquid cooling, Networking.

33 节点nodes·71 A 股A-shares·71 已加载报价quotes loaded
子系统Subsystem· 9 子节点sub-nodes
加速芯片 / GPU / ASICAccelerator Chips / GPU / ASIC
Accelerator Chips / GPU / ASIC加速芯片 / GPU / ASIC

训练与推理的算力核心 — 价值高度集中,但护城河正被定制 ASIC 蚕食The compute core for training and inference — value is highly concentrated, but the moat is being eroded by custom ASICs

部件Component· 2 子节点sub-nodes
晶圆代工 / 先进制程Foundry / Advanced Process Node
Foundry / Advanced Process Node晶圆代工 / 先进制程

GPU/ASIC 的物理载体 — 全球高端产能近乎单点依赖The physical substrate of GPUs and ASICs — global advanced capacity is nearly single-point dependent

材料Material
光刻设备 (EUV/DUV)Lithography Equipment (EUV/DUV)
Lithography Equipment (EUV/DUV)光刻设备 (EUV/DUV)

先进制程的咽喉,EUV 全球独家The chokepoint of advanced process nodes; EUV is a global monopoly

材料Material
光刻胶 / 电子特气 / 超纯材料Photoresist / Electronic Specialty Gases / Ultra-Pure Materials
Photoresist / Electronic Specialty Gases / Ultra-Pure Materials光刻胶 / 电子特气 / 超纯材料

制程耗材,日企主导但 A 股有部分切入Process consumables; dominated by Japanese firms but with some A-share exposure

部件Component· 2 子节点sub-nodes
CoWoS / 先进封装(盲区) ●CoWoS / Advanced Packaging (blind spot) ●
CoWoS / Advanced Packaging (blind spot) ●CoWoS / 先进封装(盲区) ●

GPU 卡脖子真正瓶颈不在晶圆而在 2.5D/3D 封装 — HBM 和 GPU 靠它拼在一起,产能比制程更紧The real GPU bottleneck is not wafer fab but 2.5D/3D packaging — HBM and GPU die are joined here, and capacity is tighter than advanced nodes

材料Material
ABF 载板 / 基板ABF Substrate / Organic Substrate
ABF Substrate / Organic SubstrateABF 载板 / 基板

高层数封装载板,产能稀缺(台日韩主导,A股追赶中)High layer-count packaging substrates; capacity is scarce (dominated by Taiwan, Japan, Korea; A-share catching up)

材料Material
硅中介层 / TSVSilicon Interposer / TSV
Silicon Interposer / TSV硅中介层 / TSV

2.5D 封装的连接层The interconnect layer in 2.5D packaging

部件Component· 2 子节点sub-nodes
HBM 高带宽内存(盲区) ●HBM High Bandwidth Memory (blind spot) ●
HBM High Bandwidth Memory (blind spot) ●HBM 高带宽内存(盲区) ●

AI 训练的真正命门 — 算力堆得再高,喂不进数据也白搭;A股暂无直接 HBM 玩家,澜起科技做内存接口芯片是最近似标的The true bottleneck of AI training — no matter how much compute you stack, it's useless if data can't be fed in; no direct A-share HBM player; Montage Technology (memory interface chips) is the closest proxy

材料Material
DRAM 晶圆 / 存储颗粒DRAM Wafer / Memory Die
DRAM Wafer / Memory DieDRAM 晶圆 / 存储颗粒

HBM 的基础存储单元The fundamental storage unit of HBM

材料Material
HBM 封装 / 堆叠键合HBM Packaging / Stacked Die Bonding
HBM Packaging / Stacked Die BondingHBM 封装 / 堆叠键合

多层 DRAM 垂直堆叠工艺(TSV/混合键合)Multi-layer DRAM vertical stacking process (TSV / hybrid bonding)

子系统Subsystem· 5 子节点sub-nodes
电力 · 供电基础设施(盲区) ●Power · Electrical Infrastructure (blind spot) ●
Power · Electrical Infrastructure (blind spot) ●电力 · 供电基础设施(盲区) ●

整个 AI 故事的隐藏主角 — GPU 是消耗品,电力是天花板。2030 前最稀缺的不是芯片而是接入电网的电,以及把电送进机柜的设备链The hidden protagonist of the entire AI story — GPUs are consumables, power is the ceiling. Before 2030, the scarcest resource is not chips but grid-connected electricity and the equipment chain that delivers it to the rack

部件Component· 1 子节点sub-nodes
发电 / 电源侧Power Generation / Supply Side
Power Generation / Supply Side发电 / 电源侧

AI 数据中心的电从哪来 — 核电/燃气/可再生抢电潮Where AI data center power comes from — nuclear, gas, and renewables all racing to capture demand

材料Material
天然气 / 铀 / 燃料Natural Gas / Uranium / Fuel
Natural Gas / Uranium / Fuel天然气 / 铀 / 燃料

发电一次能源Primary energy sources for power generation

部件Component· 1 子节点sub-nodes
变压器 / 电网设备Transformers / Grid Equipment
Transformers / Grid Equipment变压器 / 电网设备

把高压电降到数据中心可用,变压器全球性短缺Step down high-voltage power to data center levels; transformers face a global shortage

材料Material
铜 / 取向硅钢 / 绝缘材料Copper / Grain-Oriented Electrical Steel / Insulation Materials
Copper / Grain-Oriented Electrical Steel / Insulation Materials铜 / 取向硅钢 / 绝缘材料

变压器与配电核心原料Core raw materials for transformers and power distribution

部件Component
机柜配电 / 母线 / PDURack Power Distribution / Busbar / PDU
Rack Power Distribution / Busbar / PDU机柜配电 / 母线 / PDU

机架级电力分配,功率密度暴涨后的新瓶颈Rack-level power distribution; a new bottleneck as power density surges

子系统Subsystem· 3 子节点sub-nodes
液冷 · 散热(盲区) ●Liquid Cooling · Thermal Management (blind spot) ●
Liquid Cooling · Thermal Management (blind spot) ●液冷 · 散热(盲区) ●

GPU 功耗从风冷飙到液冷拐点 — 单机柜上百千瓦,空气压不住了。散热从'附属件'变成'决定能不能上架'的硬约束GPU power density has crossed the inflection point from air to liquid cooling — hundreds of kilowatts per rack exceed air capacity. Thermal management has shifted from an accessory to a hard constraint on deployability

部件Component
冷板 / 浸没式冷却Cold Plate / Immersion Cooling
Cold Plate / Immersion Cooling冷板 / 浸没式冷却

直触芯片的液冷换热方案Liquid cooling heat exchange solutions in direct contact with chips

部件Component
冷却液 / 工质 / 导热材料Coolant / Dielectric Fluid / Thermal Interface Materials
Coolant / Dielectric Fluid / Thermal Interface Materials冷却液 / 工质 / 导热材料

浸没冷却液与导热界面材料Immersion cooling fluids and thermal interface materials

部件Component
CDU / 泵 / 快接头CDU / Pumps / Quick-Connect Fittings
CDU / Pumps / Quick-Connect FittingsCDU / 泵 / 快接头

冷量分配单元与液路连接件Coolant distribution units and liquid loop connectors

子系统Subsystem· 4 子节点sub-nodes
光互连 · 光模块(盲区) ●Optical Interconnect · Optical Transceivers (blind spot) ●
Optical Interconnect · Optical Transceivers (blind spot) ●光互连 · 光模块(盲区) ●

算力越大,机器之间'对话'越贵 — 数据中心内部的光模块/光互连用量随 GPU 数量超线性增长,是最直接的横向受益但常被忽视The more compute, the more expensive machine-to-machine communication — optical transceiver and interconnect consumption inside data centers grows super-linearly with GPU count, a direct and often overlooked beneficiary

部件Component· 2 子节点sub-nodes
光收发器 (800G/1.6T)Optical Transceivers (800G/1.6T)
Optical Transceivers (800G/1.6T)光收发器 (800G/1.6T)

光电转换核心模块Core module for optical-to-electrical conversion

材料Material
激光器 / DFB / EML / VCSELLaser Chips / DFB / EML / VCSEL
Laser Chips / DFB / EML / VCSEL激光器 / DFB / EML / VCSEL

光模块的光源芯片Light source chips for optical transceivers

材料Material
硅光 / 光引擎 / CPOSilicon Photonics / Optical Engine / CPO
Silicon Photonics / Optical Engine / CPO硅光 / 光引擎 / CPO

共封装光学,下一代互连路线Co-packaged optics, the next-generation interconnect roadmap

部件Component
光纤 / 连接器 / 有源电缆Optical Fiber / Connectors / Active Cables
Optical Fiber / Connectors / Active Cables光纤 / 连接器 / 有源电缆

机柜内外的物理连接Physical connections inside and between racks

子系统Subsystem· 2 子节点sub-nodes
网络交换 · 互连(盲区) ●Network Switching · Interconnect (blind spot) ●
Network Switching · Interconnect (blind spot) ●网络交换 · 互连(盲区) ●

几万张 GPU 要当成'一台机器'用,靠的是超高速交换网络 — 交换机/交换芯片/NVLink 是 scale-out 的隐形主干,直接吃 GPU 集群规模红利Tens of thousands of GPUs must function as a single machine, enabled by ultra-high-speed switching networks — switches, switch ASICs, and NVLink are the invisible backbone of scale-out, directly capturing GPU cluster scale dividends

部件Component
交换 ASIC / 网卡 (DPU/SmartNIC)Switch ASIC / NIC (DPU/SmartNIC)
Switch ASIC / NIC (DPU/SmartNIC)交换 ASIC / 网卡 (DPU/SmartNIC)

网络数据面核心芯片Core chips for the network data plane

部件Component
互连协议 / Retimer / CXLInterconnect Protocols / Retimer / CXL
Interconnect Protocols / Retimer / CXL互连协议 / Retimer / CXL

PCIe/CXL/NVLink 信号完整性与扩展Signal integrity and expansion for PCIe/CXL/NVLink

子系统Subsystem· 2 子节点sub-nodes
整机 / 机架 / 服务器集成Complete Systems / Rack / Server Integration
Complete Systems / Rack / Server Integration整机 / 机架 / 服务器集成

把芯片+内存+网络+散热装成可交付的 AI 工厂 — 集成商吃规模但毛利薄Assembling chips, memory, networking, and cooling into a deliverable AI factory — integrators capture volume but at thin margins

部件Component
PCB / 高速基板 / 被动元件PCB / High-Speed Substrate / Passive Components
PCB / High-Speed Substrate / Passive ComponentsPCB / 高速基板 / 被动元件

服务器主板与高频材料Server motherboards and high-frequency materials

部件Component
机架级电源 / 电容Rack-Level Power Supply / Capacitors
Rack-Level Power Supply / Capacitors机架级电源 / 电容

服务器供电与稳压元件Server power delivery and voltage regulation components

子系统Subsystem
AI 云 / 数据中心运营 / 地产AI Cloud / Data Center Operations / Real Estate
AI Cloud / Data Center Operations / Real EstateAI 云 / 数据中心运营 / 地产

算力最终以'租'的形式变现 — 云厂商、Neocloud、数据中心 REIT 是离终端需求最近的一层Compute ultimately monetizes as a rental — hyperscalers, Neoclouds, and data center REITs are the layer closest to end demand

数据来源:沪深快照 2026-06-15(导入自原站)。akshare 实时刷新待接入。仅供研究 · 非投资建议。Source: Shanghai/Shenzhen snapshot 2026-06-15 (imported from origin). Live akshare refresh pending. Research only · not investment advice.