AI 算力 · A 股AI COMPUTE · A-shares
AI 数据中心 / 加速芯片。A 股卡位:电力、光互连、HBM、液冷、网络。AI data center / accelerator chips. A-share chokepoints: Power, Optical interconnect, HBM, Liquid cooling, Networking.
成品 / 应用End Product / App· 32 子节点sub-nodesAI 算力AI COMPUTEAI COMPUTEAI 算力大家盯着 GPU 整机和数据中心 — 但真正稀缺/被低估的价值藏在下游的电力、光模块、HBM 内存、液冷散热里Everyone watches GPU systems and data centers — but the truly scarce and undervalued assets lie downstream in power, optical modules, HBM memory, and liquid cooling
寒武纪Cambricon TechnologiesA+7.42%¥1,331.99 · ¥836.9B海光信息Hygon Information TechnologyA+6.53%¥298.29 · ¥693.3B景嘉微JingjiamicroA+2.73%¥52.32 · ¥27.3B浪潮信息Inspur Electronic InformationA+9.70%¥63.47 · ¥93.2B中科曙光Dawning Information IndustryA+3.44%¥84.98 · ¥124.3B工业富联Industrial FoxconnA+3.64%¥72.68 · ¥1.44T中际旭创Innolight TechnologyA+4.87%¥1,205.01 · ¥1.34T新易盛Eoptolink TechnologyA+6.01%¥536.88 · ¥748.5B天孚通信Tianyifu Communication TechnologyA+6.84%¥300.17 · ¥327.4B英维克Envicool TechnologyA+5.84%¥69.94 · ¥89.1B紫光股份Unisplendour CorporationA+5.45%¥26.52 · ¥75.8B兆易创新GigaDevice SemiconductorA+5.16%¥506.3 · ¥355.0B澜起科技Montage TechnologyA+4.79%¥235.66 · ¥288.0B国电南瑞NARI TechnologyA+0.73%¥23.41 · ¥188.0B
大家盯着 GPU 整机和数据中心 — 但真正稀缺/被低估的价值藏在下游的电力、光模块、HBM 内存、液冷散热里Everyone watches GPU systems and data centers — but the truly scarce and undervalued assets lie downstream in power, optical modules, HBM memory, and liquid cooling
子系统Subsystem· 9 子节点sub-nodes加速芯片 / GPU / ASICAccelerator Chips / GPU / ASICAccelerator Chips / GPU / ASIC加速芯片 / GPU / ASIC训练与推理的算力核心 — 价值高度集中,但护城河正被定制 ASIC 蚕食The compute core for training and inference — value is highly concentrated, but the moat is being eroded by custom ASICs
训练与推理的算力核心 — 价值高度集中,但护城河正被定制 ASIC 蚕食The compute core for training and inference — value is highly concentrated, but the moat is being eroded by custom ASICs
部件Component· 2 子节点sub-nodes晶圆代工 / 先进制程Foundry / Advanced Process NodeFoundry / Advanced Process Node晶圆代工 / 先进制程GPU/ASIC 的物理载体 — 全球高端产能近乎单点依赖The physical substrate of GPUs and ASICs — global advanced capacity is nearly single-point dependent
GPU/ASIC 的物理载体 — 全球高端产能近乎单点依赖The physical substrate of GPUs and ASICs — global advanced capacity is nearly single-point dependent
先进制程的咽喉,EUV 全球独家The chokepoint of advanced process nodes; EUV is a global monopoly
制程耗材,日企主导但 A 股有部分切入Process consumables; dominated by Japanese firms but with some A-share exposure
部件Component· 2 子节点sub-nodesCoWoS / 先进封装(盲区) ●CoWoS / Advanced Packaging (blind spot) ●CoWoS / Advanced Packaging (blind spot) ●CoWoS / 先进封装(盲区) ●GPU 卡脖子真正瓶颈不在晶圆而在 2.5D/3D 封装 — HBM 和 GPU 靠它拼在一起,产能比制程更紧The real GPU bottleneck is not wafer fab but 2.5D/3D packaging — HBM and GPU die are joined here, and capacity is tighter than advanced nodes
GPU 卡脖子真正瓶颈不在晶圆而在 2.5D/3D 封装 — HBM 和 GPU 靠它拼在一起,产能比制程更紧The real GPU bottleneck is not wafer fab but 2.5D/3D packaging — HBM and GPU die are joined here, and capacity is tighter than advanced nodes
高层数封装载板,产能稀缺(台日韩主导,A股追赶中)High layer-count packaging substrates; capacity is scarce (dominated by Taiwan, Japan, Korea; A-share catching up)
2.5D 封装的连接层The interconnect layer in 2.5D packaging
部件Component· 2 子节点sub-nodesHBM 高带宽内存(盲区) ●HBM High Bandwidth Memory (blind spot) ●HBM High Bandwidth Memory (blind spot) ●HBM 高带宽内存(盲区) ●AI 训练的真正命门 — 算力堆得再高,喂不进数据也白搭;A股暂无直接 HBM 玩家,澜起科技做内存接口芯片是最近似标的The true bottleneck of AI training — no matter how much compute you stack, it's useless if data can't be fed in; no direct A-share HBM player; Montage Technology (memory interface chips) is the closest proxy
AI 训练的真正命门 — 算力堆得再高,喂不进数据也白搭;A股暂无直接 HBM 玩家,澜起科技做内存接口芯片是最近似标的The true bottleneck of AI training — no matter how much compute you stack, it's useless if data can't be fed in; no direct A-share HBM player; Montage Technology (memory interface chips) is the closest proxy
HBM 的基础存储单元The fundamental storage unit of HBM
多层 DRAM 垂直堆叠工艺(TSV/混合键合)Multi-layer DRAM vertical stacking process (TSV / hybrid bonding)
子系统Subsystem· 5 子节点sub-nodes电力 · 供电基础设施(盲区) ●Power · Electrical Infrastructure (blind spot) ●Power · Electrical Infrastructure (blind spot) ●电力 · 供电基础设施(盲区) ●整个 AI 故事的隐藏主角 — GPU 是消耗品,电力是天花板。2030 前最稀缺的不是芯片而是接入电网的电,以及把电送进机柜的设备链The hidden protagonist of the entire AI story — GPUs are consumables, power is the ceiling. Before 2030, the scarcest resource is not chips but grid-connected electricity and the equipment chain that delivers it to the rack
整个 AI 故事的隐藏主角 — GPU 是消耗品,电力是天花板。2030 前最稀缺的不是芯片而是接入电网的电,以及把电送进机柜的设备链The hidden protagonist of the entire AI story — GPUs are consumables, power is the ceiling. Before 2030, the scarcest resource is not chips but grid-connected electricity and the equipment chain that delivers it to the rack
部件Component· 1 子节点sub-nodes发电 / 电源侧Power Generation / Supply SidePower Generation / Supply Side发电 / 电源侧AI 数据中心的电从哪来 — 核电/燃气/可再生抢电潮Where AI data center power comes from — nuclear, gas, and renewables all racing to capture demand
AI 数据中心的电从哪来 — 核电/燃气/可再生抢电潮Where AI data center power comes from — nuclear, gas, and renewables all racing to capture demand
发电一次能源Primary energy sources for power generation
部件Component· 1 子节点sub-nodes变压器 / 电网设备Transformers / Grid EquipmentTransformers / Grid Equipment变压器 / 电网设备把高压电降到数据中心可用,变压器全球性短缺Step down high-voltage power to data center levels; transformers face a global shortage
把高压电降到数据中心可用,变压器全球性短缺Step down high-voltage power to data center levels; transformers face a global shortage
变压器与配电核心原料Core raw materials for transformers and power distribution
机架级电力分配,功率密度暴涨后的新瓶颈Rack-level power distribution; a new bottleneck as power density surges
子系统Subsystem· 3 子节点sub-nodes液冷 · 散热(盲区) ●Liquid Cooling · Thermal Management (blind spot) ●Liquid Cooling · Thermal Management (blind spot) ●液冷 · 散热(盲区) ●GPU 功耗从风冷飙到液冷拐点 — 单机柜上百千瓦,空气压不住了。散热从'附属件'变成'决定能不能上架'的硬约束GPU power density has crossed the inflection point from air to liquid cooling — hundreds of kilowatts per rack exceed air capacity. Thermal management has shifted from an accessory to a hard constraint on deployability
GPU 功耗从风冷飙到液冷拐点 — 单机柜上百千瓦,空气压不住了。散热从'附属件'变成'决定能不能上架'的硬约束GPU power density has crossed the inflection point from air to liquid cooling — hundreds of kilowatts per rack exceed air capacity. Thermal management has shifted from an accessory to a hard constraint on deployability
直触芯片的液冷换热方案Liquid cooling heat exchange solutions in direct contact with chips
浸没冷却液与导热界面材料Immersion cooling fluids and thermal interface materials
冷量分配单元与液路连接件Coolant distribution units and liquid loop connectors
子系统Subsystem· 4 子节点sub-nodes光互连 · 光模块(盲区) ●Optical Interconnect · Optical Transceivers (blind spot) ●Optical Interconnect · Optical Transceivers (blind spot) ●光互连 · 光模块(盲区) ●算力越大,机器之间'对话'越贵 — 数据中心内部的光模块/光互连用量随 GPU 数量超线性增长,是最直接的横向受益但常被忽视The more compute, the more expensive machine-to-machine communication — optical transceiver and interconnect consumption inside data centers grows super-linearly with GPU count, a direct and often overlooked beneficiary
算力越大,机器之间'对话'越贵 — 数据中心内部的光模块/光互连用量随 GPU 数量超线性增长,是最直接的横向受益但常被忽视The more compute, the more expensive machine-to-machine communication — optical transceiver and interconnect consumption inside data centers grows super-linearly with GPU count, a direct and often overlooked beneficiary
部件Component· 2 子节点sub-nodes光收发器 (800G/1.6T)Optical Transceivers (800G/1.6T)Optical Transceivers (800G/1.6T)光收发器 (800G/1.6T)光电转换核心模块Core module for optical-to-electrical conversion
光电转换核心模块Core module for optical-to-electrical conversion
光模块的光源芯片Light source chips for optical transceivers
共封装光学,下一代互连路线Co-packaged optics, the next-generation interconnect roadmap
机柜内外的物理连接Physical connections inside and between racks
子系统Subsystem· 2 子节点sub-nodes网络交换 · 互连(盲区) ●Network Switching · Interconnect (blind spot) ●Network Switching · Interconnect (blind spot) ●网络交换 · 互连(盲区) ●几万张 GPU 要当成'一台机器'用,靠的是超高速交换网络 — 交换机/交换芯片/NVLink 是 scale-out 的隐形主干,直接吃 GPU 集群规模红利Tens of thousands of GPUs must function as a single machine, enabled by ultra-high-speed switching networks — switches, switch ASICs, and NVLink are the invisible backbone of scale-out, directly capturing GPU cluster scale dividends
几万张 GPU 要当成'一台机器'用,靠的是超高速交换网络 — 交换机/交换芯片/NVLink 是 scale-out 的隐形主干,直接吃 GPU 集群规模红利Tens of thousands of GPUs must function as a single machine, enabled by ultra-high-speed switching networks — switches, switch ASICs, and NVLink are the invisible backbone of scale-out, directly capturing GPU cluster scale dividends
网络数据面核心芯片Core chips for the network data plane
PCIe/CXL/NVLink 信号完整性与扩展Signal integrity and expansion for PCIe/CXL/NVLink
子系统Subsystem· 2 子节点sub-nodes整机 / 机架 / 服务器集成Complete Systems / Rack / Server IntegrationComplete Systems / Rack / Server Integration整机 / 机架 / 服务器集成把芯片+内存+网络+散热装成可交付的 AI 工厂 — 集成商吃规模但毛利薄Assembling chips, memory, networking, and cooling into a deliverable AI factory — integrators capture volume but at thin margins
把芯片+内存+网络+散热装成可交付的 AI 工厂 — 集成商吃规模但毛利薄Assembling chips, memory, networking, and cooling into a deliverable AI factory — integrators capture volume but at thin margins
服务器主板与高频材料Server motherboards and high-frequency materials
服务器供电与稳压元件Server power delivery and voltage regulation components
算力最终以'租'的形式变现 — 云厂商、Neocloud、数据中心 REIT 是离终端需求最近的一层Compute ultimately monetizes as a rental — hyperscalers, Neoclouds, and data center REITs are the layer closest to end demand
数据来源:沪深快照 2026-06-15(导入自原站)。akshare 实时刷新待接入。仅供研究 · 非投资建议。Source: Shanghai/Shenzhen snapshot 2026-06-15 (imported from origin). Live akshare refresh pending. Research only · not investment advice.